Geneva, Switzerland – February 20, 2025 – STMicroelectronics (NYSE: STM), a global semiconductor leader, has introduced revolutionary silicon photonics (SiPho) and next-generation BiCMOS technologies aimed at enhancing optical interconnects in data centers and AI clusters. These innovations are designed to meet the growing demands for higher performance and energy efficiency in cloud computing and artificial intelligence applications.
With the rapid expansion of AI computing, challenges in performance and energy efficiency are becoming increasingly critical. STMicroelectronics is addressing these challenges with its groundbreaking SiPho and BiCMOS technologies, which are scheduled to ramp up from the second half of 2025 for 800Gb/s and 1.6Tb/s optical modules.
At the core of data centers’ interconnections lie thousands of optical transceivers that convert optical signals into electrical signals and vice versa. These transceivers enable the flow of data between GPUs, switches, and storage systems. ST’s new SiPho technology integrates multiple complex components into a single chip, offering significant improvements in performance and energy efficiency. This integration allows for higher data transfer rates, reduced power consumption, and increased reliability, making it ideal for the demanding environments of data centers and AI clusters.
ST’s next-gen BiCMOS technology is designed to deliver ultra-high-speed and low-power optical connectivity. This technology supports the development of optical interconnect products that enable 800Gbps and 1.6Tbps solutions for hyperscalers. The next-gen BiCMOS technology ensures that data centers and AI clusters can handle the massive amounts of data generated by AI applications while maintaining energy efficiency. By leveraging the strengths of both bipolar and CMOS technologies, STMicroelectronics’ BiCMOS technology offers a unique combination of high-speed performance and low power consumption.
Both the SiPho and BiCMOS technologies will be manufactured on 300mm processes in Europe, ensuring a consistent and reliable supply for optical module providers and hyperscalers. STMicroelectronics is collaborating with key partners across the entire value chain to become a leading supplier of silicon photonics and BiCMOS wafers for the data center and AI cluster market. These partnerships are essential for driving advancements in optical interconnects and ensuring that the new technologies can be seamlessly integrated into existing and future infrastructure.
The introduction of SiPho and next-gen BiCMOS technologies by STMicroelectronics marks a significant milestone in the advancement of optical interconnects for cloud infrastructure, AI clusters, and next-generation data centers. These innovations are expected to drive higher performance, energy efficiency, and reliability, meeting the ever-growing demands of the industry. As AI and cloud computing continue to evolve, STMicroelectronics’ cutting-edge technologies will play a crucial role in shaping the future of these sectors. STMicroelectronics’ launch of SiPho and next-gen BiCMOS technologies represents a major leap forward in the field of optical interconnects. These technologies are poised to revolutionize data centers and AI clusters by providing the high-speed, energy-efficient solutions needed to support the rapid growth of AI and cloud computing. With its commitment to innovation and collaboration, STMicroelectronics is well-positioned to lead the industry into a new era of accelerated AI infrastructure and enhanced cloud computing performance.
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