In the ever-evolving landscape of automotive electronics, reliability, compactness, and high-voltage tolerance are non-negotiable. Enter the Toshiba TLX9161T, a solid-state photorelay engineered to meet the… Read More »Toshiba TLX9161T A High-Voltage Photo relay for Automotive
NVIDIA’s CUDA Toolkit 13 isn’t just an update—it’s a strategic overhaul designed to meet the demands of modern AI, scientific computing, and edge development. With… Read More »NVIDIA CUDA Toolkit 13: Surge Behind Next-Gen AI and HPC
In a major stride toward the future of high-speed data processing and photonics-electronics integration, Oki Electric Industry Co., Ltd. (OKI) has unveiled its proprietary Tiling… Read More »OKI Unveils Tiling Crystal Film Bonding Technology for Next-Gen Silicon Photonics
Arm is setting the stage for a seismic shift in mobile graphics. By 2026, the chip design giant plans to embed dedicated neural processing units… Read More »Arm Is Reimagining Mobile Graphics: AI-Powered GPUs Are Coming
In a groundbreaking move, Nvidia and AMD have agreed to pay the U.S. government 15% of their revenue from sales of specific AI chips to… Read More »Nvidia and AMD to Pay 15% of China Chip Revenue for U.S. Export Licences
Micron Technology has just flipped the switch on the future of data center storage. With the unveiling of the Micron 9650, the world’s first PCIe… Read More »Micron Launches Blazing-Fast PCIe Gen6 SSDs to Supercharge AI Data Centers
Rohm Semiconductor has introduced a groundbreaking ultra-compact power MOSFET, the AW2K21, designed to meet the growing demands of fast charging in compact electronic devices like… Read More »Rohm Shrinks Power: Ultra-Tiny MOSFET Supercharges Fast Charging Tech
Infineon Technologies has announced the launch of its next-generation CoolSiC™ MOSFET 1200 V G2, housed in a top-side-cooled (TSC) Q-DPAK package. This innovation marks a… Read More »Infineon Unveils Thermally Optimised CoolSiC™ MOSFET 1200 V G2 in Q-DPAK Package
The invisible world of precision requires special “ears.” In modern technological products such as smartphones, computers, automotive electronics, and medical devices, chips serve as miniature… Read More »Ultrasonic testing: the “stethoscope” of modern electronics manufacturing
In a bold stride toward electrification and energy efficiency, NXP Semiconductors has introduced the BMx7318/7518 family—a cutting-edge lineup of 18-channel Li-ion battery cell controller ICs… Read More »NXP Semiconductors Unveils BMx7318/7518 IC Family for Next-Gen Battery Management
