Cadence Design Systems has taken a major leap in AI infrastructure planning by expanding its Reality Digital Twin Platform to include a digital twin of… Read More »Cadence Integrates NVIDIA DGX SuperPOD into Digital Twin Platform
Wolfspeed has officially launched its 200mm SiC wafer platform for commercial use—marking a major milestone in the evolution of high-efficiency power electronics. This move follows… Read More »Wolfspeed Rolls Out 200mm Silicon Carbide Wafers
India’s semiconductor ambitions just got a major boost. At Semicon India 2025, Gujarat-based startup IndieSemiC unveiled the country’s first fully indigenous IoT Evolution Board, powered… Read More »IndieSemiC Ignites India’s IoT Revolution with VEGA-Powered Evolution Board
In a move that underscores its commitment to high-efficiency power management, Nexperia has rolled out two new USB Type-C and USB Power Delivery (PD) controller… Read More »Smart Charging, Simplified, Nexperia Launches NEX52041 and NEX52080 USB PD Controllers
Industrial memory specialist Innodisk has expanded its portfolio with the launch of DDR5 CAMM2 and LPDDR5X CAMM2 (LPCAMM2) modules, engineered to meet the performance, space,… Read More »Innodisk Unveils DDR5 and LPDDR5X CAMM2 Modules for Next-Gen Industrial Systems
In a move set to strengthen the global silicon carbide (SiC) power semiconductor supply chain, Toshiba Electronic Devices & Storage Corporation and SICC Co., Ltd.… Read More »Toshiba and SICC Forge Strategic Partnership to Advance SiC Power Semiconductor Wafers
In the ever-evolving landscape of automotive electronics, reliability, compactness, and high-voltage tolerance are non-negotiable. Enter the Toshiba TLX9161T, a solid-state photorelay engineered to meet the… Read More »Toshiba TLX9161T A High-Voltage Photo relay for Automotive
NVIDIA’s CUDA Toolkit 13 isn’t just an update—it’s a strategic overhaul designed to meet the demands of modern AI, scientific computing, and edge development. With… Read More »NVIDIA CUDA Toolkit 13: Surge Behind Next-Gen AI and HPC
In a major stride toward the future of high-speed data processing and photonics-electronics integration, Oki Electric Industry Co., Ltd. (OKI) has unveiled its proprietary Tiling… Read More »OKI Unveils Tiling Crystal Film Bonding Technology for Next-Gen Silicon Photonics
Arm is setting the stage for a seismic shift in mobile graphics. By 2026, the chip design giant plans to embed dedicated neural processing units… Read More »Arm Is Reimagining Mobile Graphics: AI-Powered GPUs Are Coming
