Melexis has unveiled the MLX90514, a groundbreaking dual-input inductive sensor IC that simultaneously reads signals from two sets of coils, enabling on-chip computation of differential… Read More »Melexis Launches MLX90514 A Dual-Input Inductive Sensor for Next-Gen Automotive Systems
Infineon Technologies has introduced a cutting-edge 12 kW power supply unit (PSU) reference design tailored for AI data centers and high-performance server platforms. This design… Read More »Infineon’s 12 kW PSU Reference Design Targets AI Data Center Efficiency and Density
STMicroelectronics has unveiled a compact 12kW power delivery prototype designed for NVIDIA’s new 800VDC data center architecture—marking a major leap in high-voltage efficiency for AI… Read More »ST Demos 12kW GaN Power Module for NVIDIA’s 800VDC AI Racks
Omnivision has introduced the OV50R40, a 50-megapixel image sensor that redefines what’s possible in mobile photography and videography. Designed for flagship smartphones, action cams, and… Read More »Omnivision’s OV50R40 for Mobile HDR and Low-Light Imaging
Arduino, long celebrated for making microcontrollers accessible to hobbyists and professionals alike, has officially entered the single-board computer (SBC) arena with the launch of the… Read More »Arduino Debuts the UNO Q, A Qualcomm-Powered Leap Into Single-Board Computing
Renesas Electronics Corporation has launched its latest innovation in industrial automation: the RA8T2 microcontroller (MCU) group, engineered specifically for high-end motor control applications. This new… Read More »Renesas Unveils RA8T2 MCU Group for High-End Motor Control
At the AI Infra Summit 2025, NVIDIA unveiled the Rubin CPX GPU—a revolutionary processor purpose-built for massive-context AI inference. Designed to handle workloads involving millions… Read More »Rubin CPX GPU NVIDIA’s Leap into Massive-Context AI
In the race to build smarter, smaller, and more efficient power electronics, Nexperia’s CCPAK1212 package stands out as a breakthrough. Designed for high-performance applications in… Read More »CCPAK1212 by Nexperia Power Efficiency in a Compact Package
Cadence Design Systems has taken a major leap in AI infrastructure planning by expanding its Reality Digital Twin Platform to include a digital twin of… Read More »Cadence Integrates NVIDIA DGX SuperPOD into Digital Twin Platform
Wolfspeed has officially launched its 200mm SiC wafer platform for commercial use—marking a major milestone in the evolution of high-efficiency power electronics. This move follows… Read More »Wolfspeed Rolls Out 200mm Silicon Carbide Wafers
