In the race to build smarter, smaller, and more efficient power electronics, Nexperia’s CCPAK1212 package stands out as a breakthrough. Designed for high-performance applications in automotive and industrial systems, this copper-clip power MOSFET package delivers exceptional current handling and thermal performance—all in a footprint that’s just 12 mm × 12 mm.
What Makes CCPAK1212 Special?
- Minimal On-Resistance: With values as low as 0.99 mΩ, it slashes conduction losses and boosts system efficiency.
- High Current Capability: Supports continuous currents over 460 A, making it ideal for demanding power environments.
- Space-Saving Design: Compared to traditional packages like TOLL, CCPAK1212 can reduce board space usage by up to 40%.
- Flexible Cooling Options:
- Bottom-cooled (CCPAK1212) for standard layouts.
- Top-cooled (CCPAK1212i) for inverted thermal designs.
- Superior Thermal Management: Copper-clip construction enables ultra-low thermal resistance (0.1 K/W) and power dissipation up to 1.5 kW.
- Automotive-Grade Reliability: Fully AEC-Q101 qualified, ensuring long-term durability in harsh environments.
As electric vehicles (EVs) transition from 12 V to 48 V architectures, CCPAK1212 is engineered to meet the evolving demands of:
- On-board chargers (OBC)
- Traction inverters
- Battery management systems (BMS)
- DC-DC converters
- Light electric vehicles (2- and 3-wheelers)
- Industrial motor drives and power modules
Its compact size and high current handling reduce the need for multiple parallel MOSFETs, simplifying designs and improving thermal performance.
CCPAK1212 isn’t just about saving space—it’s about unlocking new levels of performance. By combining low resistance, high current capability, and flexible cooling, it empowers designers to build more efficient, reliable, and compact systems.tects, it’s not just about building faster—it’s about building smarter.
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