Munich, Germany and Villach, Austria – September 11, 2024 – Infineon Technologies AG has announced a groundbreaking achievement in the semiconductor industry: the successful development and pilot production of the world’s first 300mm power gallium nitride (GaN) wafer technology. This innovation is set to revolutionize the market for GaN-based power semiconductors by leveraging existing large-scale 300mm silicon manufacturing lines.
Infineon’s pioneering effort marks a significant milestone in the semiconductor industry. By utilizing 300mm wafers, the company can produce 2.3 times more chips per wafer compared to the traditional 200mm wafers. This advancement not only enhances production efficiency but also promises substantial cost benefits over time, potentially achieving cost parity with silicon.
GaN-based power semiconductors are rapidly gaining traction across various sectors, including industrial, automotive, consumer electronics, computing, and communication. These semiconductors are integral to power supplies for AI systems, solar inverters, chargers, adapters, and motor-control systems. The state-of-the-art GaN manufacturing processes lead to improved device performance, offering end-users benefits such as higher efficiency, smaller size, lighter weight, and lower overall cost.
Infineon has successfully integrated the 300mm GaN wafer technology into its existing 300mm silicon production line at its power fab in Villach, Austria. This strategic move leverages the company’s well-established expertise in 300mm silicon and 200mm GaN production, ensuring a seamless transition and scalability aligned with market demands.
The introduction of 300mm GaN technology is expected to significantly shape the growing GaN market, which is projected to reach several billion US dollars by the end of the decade. Infineon’s CEO, Jochen Hanebeck, emphasized the company’s commitment to innovation and leadership in the GaN market, highlighting the technological breakthrough as an industry game-changer.
Infineon plans to further scale its GaN capacity in line with market needs, strengthening existing solutions and enabling new applications with a cost-effective value proposition. The company will showcase the first 300mm GaN wafers at the upcoming electronica 2024 trade show in Munich, from November 12-15.
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