Renesas Electronics Corporation has taken a major leap forward in automotive innovation by introducing its first automotive-qualified Bluetooth Low Energy (LE) system-on-chip (SoC), the DA14533. This cutting-edge chip is set to transform vehicle connectivity, delivering unparalleled power efficiency, compact design, and reliable performance.
The DA14533 integrates a 2.4-GHz radio transceiver, an Arm Cortex-M0+ processor, and memory, all packed into a space-saving 3.5-mm square package. With ultra-low-power modes such as hibernation mode consuming as little as 500 nA, it’s ideal for applications like tire pressure monitoring systems and remote access systems that demand exceptional energy efficiency.
With AEC-Q100 Grade 2 qualification, the DA14533 ensures top-tier reliability under challenging automotive conditions. Operating across an extended temperature range of -40°C to +105°C, the chip has undergone rigorous testing to meet industry standards for durability and reliability.
Renesas’ DA14533 empowers automotive systems to adopt smarter features such as keyless entry, onboard diagnostics, and battery management. Its highly integrated design simplifies system development, minimizes costs, and accelerates product rollout.
Renesas, having shipped millions of Bluetooth LE chips for industrial applications, is now extending its expertise to the automotive sector with the DA14533. The SoC represents a groundbreaking advancement, combining state-of-the-art technology with proven reliability to enable more connected, efficient, and smarter vehicles.
By launching its debut automotive-grade Bluetooth LE SoC, Renesas is poised to reshape the automotive landscape, making strides toward a future where wireless technologies enhance the driving experience. This innovation not only addresses current connectivity needs but also lays the groundwork for next-generation automotive systems.
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