In a move set to strengthen the global silicon carbide (SiC) power semiconductor supply chain, Toshiba Electronic Devices & Storage Corporation and SICC Co., Ltd. have signed a Memorandum of Understanding (MOU) to collaborate on improving the characteristics and quality of SiC power semiconductor wafers, while expanding the supply of stable, high-quality wafers from SICC to Toshiba.
Power semiconductors are critical for converting and controlling electricity in a wide range of applications — from electric vehicles (EVs) and renewable energy systems to industrial equipment. SiC-based devices, in particular, offer superior efficiency, high-temperature tolerance, and reduced energy losses, making them a key enabler for carbon neutrality goals.
However, producing SiC wafers with consistent quality and reliability remains a challenge. This partnership aims to address that gap by combining Toshiba’s expertise in SiC device design and manufacturing with SICC’s leadership in single-crystal SiC wafer technology.
Partnership Highlights
- Joint Development Goals: Enhance wafer quality, improve performance characteristics, and ensure stable supply for high-demand sectors.
- Application Focus: Railways, server power supplies, automotive systems, and other high-efficiency power conversion applications.
- Technology Synergy: Toshiba’s track record in SiC power semiconductors complements SICC’s innovations, including the world’s first 12-inch SiC wafer introduced in 2024.
- Market Impact: Expected to accelerate the adoption of SiC devices globally, supporting the expansion of the SiC power semiconductor market.
About the Companies
- Toshiba Electronic Devices & Storage Corporation — A pioneer in SiC power semiconductors, with applications spanning rail transport to next-generation automotive systems. The company is focused on reducing power losses and boosting device reliability.
- SICC Co., Ltd. — Founded in 2010, SICC is a Chinese leader in single-crystal SiC wafer production, holding a top-five global patent position in the field. Following its 2022 IPO, it has rapidly expanded market share and technological capabilities.
While the MOU outlines the intent to collaborate, specific project details are still under discussion. Both companies see this as a strategic step toward strengthening the SiC supply chain, enabling faster innovation, and meeting the surging demand for energy-efficient power electronics.
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