Wolfspeed has officially launched its 200mm SiC wafer platform for commercial use—marking a major milestone in the evolution of high-efficiency power electronics.
This move follows a successful early-access phase, during which select customers tested the wafers in real-world applications. Now, Wolfspeed is scaling up availability, offering both bare and epitaxial 200mm wafers to a broader market.
The transition from 150mm to 200mm wafers isn’t just about size—it’s about performance, scalability, and cost efficiency. Wolfspeed’s new wafers feature:
- 350µm thickness for improved mechanical stability
- Exceptional doping and thickness uniformity across the wafer
- Enhanced MOSFET yields, reducing manufacturing waste
- Optimized epitaxy for faster device development
These improvements are designed to help manufacturers accelerate their product timelines while maintaining high quality and reliability.
The launch is expected to benefit sectors that rely heavily on power-dense, energy-efficient components, including:
- Electric vehicles (EVs)
- Renewable energy systems
- Industrial motor drives
- Data center power infrastructure
By enabling higher performance and lower energy loss, Wolfspeed’s 200mm SiC wafers could play a key role in global efforts to reduce carbon emissions and improve energy efficiency.
Wolfspeed’s expansion into 200mm wafer production aligns with its broader strategy to lead the transition from traditional silicon to silicon carbide. The company is investing heavily in capacity and innovation to meet growing demand, positioning itself as a cornerstone supplier for next-generation power electronics.
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