SiTime Corporation has unveiled its latest innovation, the SiT30100, a high-precision MEMS clock generator designed to enhance the performance and efficiency of mobile and IoT… Read More »SiTime Introduces SiT30100, Precision Timing for Next-Gen Mobile and IoT Devices
TSMC has introduced its A14 process, a 1.4nm chip technology designed to enhance performance and efficiency in next-generation semiconductor manufacturing. With production planned for 2028,… Read More »EDA Firms Support TSMC’s Next-Gen A14 Chip Technology
Infineon Technologies has introduced its latest advancement in silicon carbide (SiC) power devices: trench-based SiC superjunction (TSJ) technology. This innovation blends trench and superjunction designs,… Read More »Infineon Unveils New SiC Superjunction Technology
Omnivision is transforming the future of driver monitoring systems (DMS) with the launch of its powerful OX01N1B image sensor—a 1.5-megapixel global shutter sensor designed to… Read More »Omnivision’s Latest 1.5 MP Global Shutter Sensor For Driver Monitoring
